| 摘要 |
PURPOSE:To facilitate resin sealing of a semiconductor with very few voids in the sealing resin by a method wherein hot-melting type epoxy resin is provided on a part of a semiconductor chip to be sealed and the hot-melting type epoxy resin is melted in a reduced pressure and soldified under a normal pressure to seal the part to be sealed. CONSTITUTION:Hot-melting type epoxy contains filler, coloring agent and other additives if necessary. The form of the hot-melting type epoxy resin is preferably pellets. If the size and form of the hot-melting type epoxy resin are matched with the form of a semiconductor chip, the semiconductor chip can be sealed uniformly. The thickness of the sealing resin can be adjusted in accordance with the required performance of the semiconductor chip and by the fluidity of the pellet. It is to be noted that the resin is preferably heated to melt by a hot-plate.
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