| 摘要 |
PURPOSE:To avoid corrosion of wiring layers and improve operating lifetime by a method wherein wiring boards whose substrates are impregnated with epoxy resin doped with hardner, a semiconductor chip which is attached to the 1st wiring layer of the wiring boards and connected to the 2nd wiring layer and a cover which encloses the semiconductor chip are provided. CONSTITUTION:1st wiring board 1 and 2nd wiring board 2, whose substrate are impregnated with epoxy resin doped with aromatic amine system hardner and which have wiring layers composed of copper foils plated with at least one of gold and silver and formed into predetermined patterns, are laminated. A hole 4 is formed so as to pierce through the 2nd wiring board 2 and the wiring layer 3 of the 1st wiring board 1 is exposed at the bottom of the hole 4. A semiconductor chip 5 is attached to the bottom of the hole and the bonding pad regions 6 of the semiconductor chip 5 are connected to the wiring layer 7 of the 2nd wiring board 2 by wires 8. A cover 9 made of metal, ceramic or resin is fixed to the 2nd wiring board 2 so as to enclose the semiconductor chip 5. With this constitution, the operating lifetime of the semiconductor chip can be made longer than that with the conventional constitution. |
