| 摘要 |
The present invention relates to an automated production method for a printed circuit or a printed-circuit board. …<??>This printed circuit consists of a carrier (10), conductive side regions and/or conductive side tracks (15) and a conductive central zone (14), which are located on one of the sides of the carrier. Before fitting the electrically conductive film, which makes it possible to obtain the said conductive zones (15, 14), the carrier (10) is provided with transverse perforations (12) and a centrally located recess (13) in which an integrated circuit (17) is accommodated. The small wire connections (18) of the integrated circuit (17) are inserted into the transverse perforations (12) and are attached there to the electrically conductive tracks (15). …<IMAGE>… |
