发明名称 |
THERMOSETTING RESIN COMPOSITION HAVING LOW SHRINKAGE |
摘要 |
PURPOSE:To obtain the titled composition having excellent storage stability and giving a cured product having low cure-shrinkage and excellent surface smoothness and luster without staining the mold nor causing mottling of the product, by compounding a specific hydroxyl-containing (meth)acrylate polymer with a thermosetting resin. CONSTITUTION:The objective composition can be produced by compounding (A) a hydroxyl-containing (meth)acrylate polymer produced by polymerizing a hydroxyl-containing (meth)acrylate oligomer of formula (R is H or methyl; Z is 2-20C bivalent organic group; n is 1-100) and optionally a monomer copolymerizable with said oligomer and (B) a thermosetting resin. The content of the oligomer in the component A is 5-90(wt)% and the amount of the component A is 1-40%, preferably 2-30% of the sum of the components A and B.
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申请公布号 |
JPS62273248(A) |
申请公布日期 |
1987.11.27 |
申请号 |
JP19860113632 |
申请日期 |
1986.05.20 |
申请人 |
NIPPON SHOKUBAI KAGAKU KOGYO CO LTD |
发明人 |
MINAMI KENJI;URASHIMA NOBUAKI;SANO SADANORI;FUKUCHI SHUZO |
分类号 |
C08L67/06;C08F299/04;C08L33/00;C08L33/02;C08L33/04;C08L33/14;C08L67/00 |
主分类号 |
C08L67/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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