| 摘要 |
PURPOSE:To facilitate resin sealing of a semiconductor with very few voids in the sealng resin by a method weherein hot-melting type epoxy resin is provided on a part of a semiconductor chip to be sealed so as to have point contact with the part to be sealed and the hot-melting type epoxy resin is melted from the part contacted with the semiconductor chip and solidified to seal the part to be sealed. CONSTITUTION:Hot-melting type epoxy resin has point contact with a semiconductor chip. The hot-melting type epoxy resin contains filler, coloring agent and other additives if necessary. The form of the hot-melting type epoxy resin is preferably pellets which have spherical surfaces at least on their one sides and especially which have oval cross-sections. If the size and the form of the hot-melting type epoxy resin are matched with the form of the semiconductor chip, the semiconductor chip can be sealed uniformly. The thickness of the sealing resin can be adjusted in accordance with the required performance and the fluidity of Further, the hot-melting type epoxy resin material can be obtained by molding B-stage shape epoxy powder and it is more preferable to employ voidless epoxy pellets at that time.
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