摘要 |
PURPOSE:To perform high-speed packaging inspection by an optical system of simple constitution and to apply it in either packaging direction by making at least two slit beams which are projected in different direction cross each other and irradiating a component with them slantingly. CONSTITUTION:Laser beams L1 and L2 outputted by semiconductor lasers 2 and 3 are converted by cylindrical lenses 4 and 5 into slit beams l1 and l2, which are made to cross each other and illuminate the top surface of the component Q slantingly at a specific angle. Bright lines m1 and m2 are formed crossing each other on the component Q along the irradiation positions of the beams l1 and l2 and bright lines n1 and n2 are formed on a printed board P similarly. Then, the image of the top surface of the component Q and its periphery are picked up by a TV camera 6 from right above and the obtained image signal is A/D-converted 7 and stored in a memory 8. Image data in the image memory 8 is read out by a CPU 9 and compared with a previously stored reference image to judge the packaging state of the component Q.
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