发明名称 |
ELECTRICAL CONTACT MATERIALS |
摘要 |
Electrical contact materials are provided which belong to the general category of copper that is overplated with a noble metal, usually gold. The improvement resides in the provision of an electroless nickel deposit laid down over the copper layer and under the gold layer, which electroless nickel deposit is laid down from a particular class of nickel-boron or nickel-phosphorus baths. |
申请公布号 |
DE3374153(D1) |
申请公布日期 |
1987.11.26 |
申请号 |
DE19833374153 |
申请日期 |
1983.01.12 |
申请人 |
RICHARDSON CHEMICAL COMPANY |
发明人 |
BAUDRAND, DONALD W. |
分类号 |
H01H1/04;H01B1/02;H01H1/025;H01L23/48;H05K3/24;(IPC1-7):H01B1/00;C25D3/48;C23C18/42;C23C18/34 |
主分类号 |
H01H1/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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