发明名称 ELECTRICAL CONTACT MATERIALS
摘要 Electrical contact materials are provided which belong to the general category of copper that is overplated with a noble metal, usually gold. The improvement resides in the provision of an electroless nickel deposit laid down over the copper layer and under the gold layer, which electroless nickel deposit is laid down from a particular class of nickel-boron or nickel-phosphorus baths.
申请公布号 DE3374153(D1) 申请公布日期 1987.11.26
申请号 DE19833374153 申请日期 1983.01.12
申请人 RICHARDSON CHEMICAL COMPANY 发明人 BAUDRAND, DONALD W.
分类号 H01H1/04;H01B1/02;H01H1/025;H01L23/48;H05K3/24;(IPC1-7):H01B1/00;C25D3/48;C23C18/42;C23C18/34 主分类号 H01H1/04
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