A peeling type developing method and apparatus for removing exposed photoresist from printed circuit boards. The printed circuit board is covered with a photopolymerization compound layer and then a transparent support layer. After exposure, a thin adhesive tape is stuck to the support layer extending obliquely across the board and crossing opposite corners thereof. The adhesive tape, together with the support layer and the unexposed portions of the photoresist material, are peeled off the printed circuit board by a pair of pinch rolls with the aid of a peeling bar in line contact with the substrate through the adhesive tape and the support layer.
申请公布号
DE3526696(C2)
申请公布日期
1987.11.26
申请号
DE19853526696
申请日期
1985.07.25
申请人
NITTO ELECTRIC INDUSTRIAL CO., LTD., IBARAKI, OSAKA, JP
