| 摘要 |
PURPOSE:To obtain a copper-clad laminate having a strong adhesion to copper foil and having high heat resistance, by laminate-molding a copper foil with a prepreg sheet impregnated with a specified polyimide and/or polyamic acid as its precursor. CONSTITUTION:A prepreg sheet is obtained by impregnating a sheet substrate with a polymer having repeating units of formula I [wherein Y is a group of formula II and/or formula III]. A copper foil is laminate-molded with this prepreg sheet. The polymer of formula I is a polyimide obtained by reacting 2,2-bis[4-(3-aminophenoxy-phenyl]propane with 3,3',4,4'-benzophenonetetracarboxy lic dianhydride and/or a polyamic acid as its precursor.
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