| 摘要 |
PURPOSE:To perform the position alignment of a wafer with high accuracy by a method wherein the position of a mark for position alignment provided on a mask is varied in accordance with a position to be transferred onto a wafer and the position alignment is performed directly with the mark used for each mask. CONSTITUTION:Using a plurality of masks 20 having prescribed patterns formed thereon, a plurality of mask patterns are transferred onto a wafer 40 sequentially through the intermediary of a projection optical system 30, and the peripheral portion of each mask pattern area is joined together on the wafer 40, so as to form one chip pattern. On each mask 20, on the occasion, a first group of marks 21a-21d for position alignment are formed near two peripheral portions, at least, of the mask pattern area which are not joined on the wafer. Moreover, a second group of marks 41a-41h for position alignment to be aligned in position with the group of marks 21a 21d of each mask 20 are formed beforehand on the wafer 40. The relative positions of the first and second groups of marks for position alignment are aligned, and each mask pattern is exposed. |
