摘要 |
PURPOSE:To produce the title polyimide of excellent heat resistance, by reacting a specified polyamic acid with a bis(imide acrylate). CONSTITUTION:Either a polyamic acid (A) having repeating units of formula I (wherein R1 is a tetravalent organic group and R2 is a bivalent organic group) or a mixture (B) of a tetracarboxylic acid of formula II or a tetracarboxylic acid (halide or ester) (a) of formula III (wherein R4-7 are each H, F, Cl, I or a hydrocarbon) with a diamino compound (b) of formula IV is mixed with a bis(imide acrylate) (C) of formula V (wherein R3 is a bivalent organic group) to perform the dehydration and imide ring formation of component A and the crosslinking by polymerization of component C or to perform the polycondensation of component (a) with component (b) and the crosslinking of component C. In this way, an interintruded high-molecular network polyimide containing bis(imide acrylate) units of the structure of formula VII among the repeating units of a polyimide having repeating units of formula VI (wherein n is a positive integer) can be obtained.
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