发明名称 WIRE-BONDING UNIT
摘要 PURPOSE:To enable wiring material to be bonded to a pad without difficulties by a method wherein the feeding port of a feeder section supplying wiring material is allowed to be positioned in the vicinity of the end of an elevated bonding tip. CONSTITUTION:As the result of the rotation of a pinch roller 12, wiring material 2 supplied from a bobbin 11 is projected to an end 1A of a bonding tip 1 from a feeding port 3A guided by a feeder section 3. The projected wiring material 2 is held by the end 1A and, when it arrives at a spot for wiring, the bonding tip 1 is caused to descend by an elevator 5 for the bonding of the wiring material 2 to a prescribed pad 6. The bonding tip 1 is allowed to descend holding the wiring material 2 when a plate 19 is caused to escape in an arrow-indicated direction. Accordingly, when the transfer of a table 10 is accomplished with accuracy, the wiring material 2 can be bonded to the prescribed pad 6 without any positional deviation by causing the bonding tip 1 to descend in a direction of Z.
申请公布号 JPS62269333(A) 申请公布日期 1987.11.21
申请号 JP19860115357 申请日期 1986.05.19
申请人 FUJITSU LTD 发明人 OIKE YOSHIO;KAWAMURA YASUO
分类号 H05K3/32;H01L21/60 主分类号 H05K3/32
代理机构 代理人
主权项
地址