| 摘要 |
PURPOSE:To facilitate an impedance matching by a method wherein, with a conductor film formed on the rear surface of a substrate, microstrip lines are constituted of transmission lines formed on the substrate surface and the conductor film and furthermore, the peripheral parts of the transmission lines are each formed in a constitution wherein the lineal width is augmented in a tapered form. CONSTITUTION:In an LCC, with a conductor film 4, which is used as an earthing surface, formed on the rear surface of an alumina ceramic substrate 1, microstrip lines are constituted of transmission lines 2 formed on the substrate surface and the conductor film and furthermore, the peripheral parts of the transmission lines are each formed in a constitution wherein the lineal width is augmented in a tapered form. Accordingly, the width of each transmission line and the substantial thickness of the substrate are made equal by the conductor film and the characteristic impedance can be easily set at the prescribed value like 50OMEGA and so on, for example, and moreover, the miniaturization of the size of the LCC and the improvement of the heat dissipation property thereof can be attained and furthermore, the impedance matching between the LCC and an external circuit is facilitated. In addition, the thickness H of the substrate 1 and the width Wa of each transmission line 2 are set within an extent of 50-150mum. |
