发明名称 LEAD FRAME FOR DIP TYPE INTEGRATED CIRCUIT MODULE
摘要 PURPOSE:To contrive the improvement of productivity by a method wherein the title lead frame is constituted in a structure wherein lead terminals are arranged being set two pieces as a pair in the shape of facing each other on the right and left sides of a metal strip and both ends or one end of each lead terminal are /is connected to one or a plurality of tie bars having pilot holes. CONSTITUTION:As pairs of lead terminals 1 are provided on one lead frame 51 in opposition to the shape of being attached on the opposed two sides of a circuit substrate 60 of a DIP type integrated circuit module 80, the same number of lead terminals can be always made simultaneously on the right and left sides, a one-turn winding reel 5 is enough, the size is also only increased to about two times in width and a process, wherein the lead frame is cut off right and left at the time of use and the terminals are faced in opposition, has only to be added. Tie bars 31-33 serve also as protectors in the handling of the continuous lead terminals and can be two at the both ends or one only at the central part according to the form, and pilot holes 34 also have only to be provided in the necessary tie bars only. Thereby, the productivity is improved.
申请公布号 JPS62269348(A) 申请公布日期 1987.11.21
申请号 JP19860115368 申请日期 1986.05.19
申请人 FUJITSU LTD 发明人 KOKUBU TAKAYOSHI
分类号 H01L23/50;H01L21/48 主分类号 H01L23/50
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