| 摘要 |
PURPOSE:To encapsulate a large-sized semiconductor element by forming internal leads connecting the semiconductor element to conductive members and a resin layer sealing the internal leads as well as the semiconductor element, leaving part of each conductive member. CONSTITUTION:Conductive members 3 positioned in a resin layer 1 and extended to the outside of the resin layer 1 from the lower section of a semiconductor element 2 and an insulating fixing layer 7 for fixing the semiconductor element 2 onto the conductive members 3 are shaped. Since the conductive members 3 are formed so as to be superposed to the lower section of the semiconductor element 2, a section to which the conductive members 3 are arranged does not function as a section excess to the housing section of the semiconductor element 2. Accordingly, the large-sized semiconductor element 2 can be encapsulated into the sealing resin layer 1 having a small volume. |
