| 摘要 |
<p>A method of soldering an electronic component (2) to a printed circuit substrate (16) comprises: forming a multipad solder preform (6) of predetermined thickness with a plurality of perforations (10) in a pattern complementing the pattern of leads or pins (4) on the component; fluxing the preform; sandwiching the preform (6) between the component (2) and the printed circuit substrate (16) so as to align the component leads or pins (4), non perforated preform areas (12), and lands or through holes (14) in the substrate (16), and reflowing the solder.</p> |
