| 摘要 |
PURPOSE:To perform mounting by a surface mounting method, to implement automatic manufacturing readily and to enhance mounting density, by forming the outer electrode terminals of a hybrid integrated circuit device so that one end of each terminal is extended, in the manner so as to draw an arc toward the center on the side of the second main surface of a semiconductor. CONSTITUTION:A plurality of outer connecting terminals 6' are provided at the side end part of a hybrid integrated circuit substrate 5 at a specified interval. Each terminal has an arc part 7. The other end of the part 7 is extended, describing an arc toward the center on the side of the second main surface of the hybrid integrated circuit substrate 5. The tip surface of the arc part 7 is contacted with the second main surface toward the first main surface. A hybrid integrated circuit 1 is mounted on the conductor bonding part of a printed wiring board, on which solder paste is printed, and reflow is performed. The solder between the conductor bonding part of the printed wiring board and the arc parts 7 of the outer electrode terminals 6' is fused and solidified. The hybrid integrated circuit device 1 is mounted on the printed wiring board by a surface mounting method. Thereby the manufacturing processes becomes easy, and the mounting density can be made high. |
