| 摘要 |
PURPOSE:To prevent lead pins projected externally from sealing resin and the sealing resin from separating at boundary therebetween by coloring the parts of the pins at least at the side of the resin with a color easily absorbing heat rays. CONSTITUTION:Lead pins 5 are projected externally of resin 4, and soldered partly at 7 to a circuit substrate to be electrically connected. The parts 6 of the pins 5 at the side of the sealing resin 4 is colored, for example, with a color for easily absorbing heat rays except the soldered parts 7 of the pins 5. In other words, since the parts 6 of the pins 5 are colored with black, the infrared ray radiating energy absorption rate of the colored part of the pin 5 is enhanced at the time of refeeding the solder with infrared rays to approach the temperature rise of the pin 5 to that of the resin. Thus, the thermal stress of the boundary of the pin 5 and the resin can be alleviated to prevent the pins 5 and the resin from separating at the boundary therebetween. |
