发明名称 HEAT-RESISTANT RESIN COMPOSITION
摘要 PURPOSE:To obtain the title resin composition excellent in heat resistance, low-temperature flexibility, strength, etc. and suitable for coating wires, etc., by mixing polyethylene with a benzimidazole compound, a hindered phenol compound and a sulfur compound. CONSTITUTION:The purpose heat-resistant resin composition is obtained by mixing 100pts.wt. polyethylene with 5-20pts.wt. benzimidazole compound (e.g., 2-mercaptobenzimidazole), 2-15pts.wt. hindered phenol compound [e.g., 1,3,5-tris(3,5-di-t-butyl-4-hydroxybenzoyl) isocyanurate] and 0.5-5pts.wt. sulfur compound (e.g., dilauryl thiodipropionate) as effective components. This resin composition is suitable as a composition for coating wires of aircraft which must have particularly excellent heat resistance and low-temperature flexibility.
申请公布号 JPS62265333(A) 申请公布日期 1987.11.18
申请号 JP19860108800 申请日期 1986.05.12
申请人 MITSUBISHI CABLE IND LTD 发明人 FUJITA TOSHINORI;KAIDE TAMOTSU
分类号 C08L23/06;C08K5/00;C08K5/13;C08K5/34;C08K5/36;C08K5/37;C08L7/00;C08L21/00;C08L23/00;C08L23/04;C08L23/08;C08L33/00;C08L33/02;C08L101/00;H01B3/44 主分类号 C08L23/06
代理机构 代理人
主权项
地址