| 摘要 |
<p>PURPOSE:To eliminate voids in a part to be finally obtained by anodic bonding by separating in advance at least one SiO2 by grooves into a plurality of insular parts. CONSTITUTION:A plurality of insular SiO2 7 separated by grooves 6 are formed by patterning on one Si substrate 5, the surfaces of SiO2 7 and SiO2 3 are opposed to be bonded in this state. When temperature is raised in a furnace, the surface of the SiO2 7 is started to be bonded at the side of the substrate 5, so that voids resulted from bonding at multiple points are concentrated in the groove 6. Thus, when the grooves formed by the voids are thereafter removed, a small substrate having a bonded part without void can be obtained.</p> |
