| 摘要 |
PURPOSE:To obtain a semiconductor device a base element of which fulfills a shock- absorbing function and can protect the device effectively from a shock from outside, by fixing a semiconductor chip not onto a package substrate directly, but onto the base element. CONSTITUTION:Base elements 4 each of which has the same width as a semiconductor chip 2 are gathered in a prescribed amount and cramped together. These base elements 4 are made of the same material as the semiconductor chips 2, e.g. ceramics. Thereby the expansion coefficient of the base elements 2 is made equal to that of the semiconductor chips 2. Next, the semiconductor chips 2 formed in a large number on a semiconductor wafer are trimmed in the shape of a strip. On the occasion, first the long side of the semiconductor chip 2, i.e. the side thereof contacting the semiconductor chip adjacent thereto, is diced in a half cut, and then the short side thereof is cut in a through cut. Subsequently, a bonding agent is applied to a prescribed portion of the bundle of the base elements 4, and a plurality of semiconductor wafers 5 are put on the base elements 4 and bonded thereto. After the completion of setting, a light force is applied to the semiconductor wafers 6 or the base elements 4. Then the semiconductor wafers 5 are separated with each base element 4 at the half-cut portions thereof.
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