首页
产品
黄页
商标
征信
会员服务
注册
登录
全部
|
企业名
|
法人/股东/高管
|
品牌/产品
|
地址
|
经营范围
发明名称
METHOD AND DEVICE FOR CUTTING THIN BAND BODY
摘要
申请公布号
JPS62259793(A)
申请公布日期
1987.11.12
申请号
JP19860104516
申请日期
1986.05.07
申请人
TEIJIN SEIKI CO LTD
发明人
HASHIMOTO TAKASHI
分类号
B26D1/04
主分类号
B26D1/04
代理机构
代理人
主权项
地址
您可能感兴趣的专利
METHOD OF PRODUCING CELL CULTURE CONTAINER
一种安全点火器
Hybrid catalyst for NOx reduction using fuel hydrocarbons as reductant
液控盘式制动装置
NATURAL ORIENTAL MEDICINAL COMPOSITION FOR THE PROMOTION OF HAIR GROWTH AND METHOD FOR PREPARING THE SAME
Method for detecting pixel status of flat panel display and display driver thereof
Seat support structure for a child motion device
Radiation image storage panel suitable for use in mammographic applications.
AN ELECTRO-OPTIC DEVICE AND A METHOD FOR PRODUCING THE SAME
Position detecting device
Method and devices for compressing delta log using flash transactions
SERVICE-AWARE QUALITY MONITORING AND CONTROL IN A RADIO ACCESS NETWORK
METHOD FOR ASSAYING ACTIVE ANTHRAX PROTECTIVE ANTIGENS
METHOD AND APPARATUSES FOR SECURING COMMUNICATIONS BETWEEN A USER TERMINAL AND A SIP PROXY USING IPSEC SECURITY ASSOCIATION
METHOD OF MAKING A MULTILAYERED DUPLEX MATERIAL ARTICLE
COMPOSITIONS AND METHODS FOR INHIBITING ADHESIONS
BASEBAND SAMPLE SELECTION
SAFETY DEVICE FOR A SEMICONDUCTOR SWITCH
GROUP WIRING SYSTEM ALLOWING LOCATING OF WIRE PAIRS AND METHOD FOR LOCATING WIRE PAIRS IN GROUP WIRING SYSTEM
Light-emitting apparatus
