Improved electroless plating process.

摘要

A process for electroless plating a conductive layer to the surface of a non-conductive material comprises: (a) preparing a liquid dispersion of carbon black comprised of: (l) carbon black particles having an average particle diameter of less than about 3.0 microns in said dispersion; (2) an effective dispersing amount of a surfactant which is compatible with said carbon black; and (3) liquid dispersing medium, wherein the amount of carbon black is sufficient to coat substantially all of said non-conducting surfaces and is less than about 4% by weight of said liquid dispersion; (b) applying said liquid dispersion to the surface of the non-conducting material; (c) separating substantially all of said liquid dispersing medium from said carbon black particles, whereby said particles are deposited on said non-conductive surface in a substantially continuous layer; and (d) electroless plating a substantially continuous conductive metal layer over the deposited carbon black layer and said non-conductive surface. i