| 摘要 |
<p>A highly magnetic Hall element comprising a substrate (l), a Hall element chip (25) mounted on the substrate (l), and a magnetic member (23) interposed between the substrate (l) and the chip (25). The magnetic member (23) increases the coercive force of the element, and is formed by laminating resin layers mixed with powder having a high magnetic permeability, one upon another, by stencil printing on that side of a semiconductor wafer (20) in which a Hall element is mounted. The wafer (20) and the magnetic member (23) are diced together, to provided a Hall element chip (25). The magnetic member (23) formed on the Hall element chip (25) is adhered to substrate (l), with half-cured surface (23a) put in contact with the substrate (l).</p> |
