发明名称 METHOD FOR APPLYING RESIN SOLUTION TO PRINTED CIRCUIT BOARD BY DRIP-COATING
摘要 PURPOSE:To prevent the clogging of the needle of a dispenser using a filler- containing resin solution as a resin solution, by forming the needle of said dispenser into a tapering shape. CONSTITUTION:A resin solution is prepared by adding a solvent to a mixture consisting of a thermosetting resin such as a phenol resin or an epoxy resin, an inorg. filler such as calcium carbonate, alumina or talc and additives if necessary and has viscosity of 5-300 poise/25 deg.C. In order to automatically perform drip-coating work using said resin solution, a needle is formed into a tapering needle 5 tapered from the root thereof to the leading end thereof. By this method, the clogging of the needle by the resin solution is prevented to make it possible to easily prepare a highly reliable printed circuit board such as hybrid IC.
申请公布号 JPS62258776(A) 申请公布日期 1987.11.11
申请号 JP19850292927 申请日期 1985.12.27
申请人 SUMITOMO BAKELITE CO LTD;SUMITOMO DEYUREZU KK 发明人 SANUKI SETSUO;HIRAI MASATOSHI
分类号 B05D1/40;H01L21/56;H05K3/00 主分类号 B05D1/40
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