| 摘要 |
PURPOSE:To form a solder composition and the shape of a bump electrode uniformly by ejecting molten solder to bump formation foundation electrode surfaces shaped to one or both of a flip chip or a circuit substrate from a nozzle for a dispenser. CONSTITUTION:A cylindrical box body 12 is mounted to a dispenser 10, and flaky solder 9 is inserted and stored previously into the box body 12. A sheathed wire heater 11 is installed to the peripheral side of the box body 12. The upper section of the box body 12 is connected to a pressure source for supplying the circuit substrate 15 side with molten solder 14 ejected from a nozzle 13 for the dispenser 10. That is, molten solder 14 blown out of the nozzle 13 is determined by applying pulse pressure to a head for the dispenser 10 by the operation of a gas ON-OFF valve. Accordingly, solder bumps are formed uniformly at high speed. |
