| 摘要 |
The disclosure relates to a method of bonding columbium to columbium wherein a brazing foil of titanium which has been coated with either a layer of copper or a layer of nickel or layers of copper and then nickel, preferably on both sides of the foil, is disposed between the columbium sheets or the like to be joined. The columbium are placed in intimate contact with opposite sides of the foil and heated to a temperature above the eutectic point of the eutectics of the metals of the foil and no higher than about 1750 DEG F. for about 90 minutes and then cooled to provide the desired bond.
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