| 摘要 |
PURPOSE:To improve the reliability of damp-proofing after mounting by bonding a semiconductor chip and a sealing resin, using the O crosslinking of Si in the semiconductor chip and Si in the sealing resin as a main body. CONSTITUTION:An epoxy resin such as cresol novolak type epoxy resin having epoxy equivalent of 160-300 and the softening point of 50-130 deg.C and a resin such as alkylated phenol novolak resin having hydroxyl equivalent of 70-180 and the softening point of 50-110 deg.C as a hardener for said epoxy resin are employed as principal ingredients, triethanolamine is added as a hardening accelerator, and these compounds are pre-reacted with a silane compound such as N-(2-aminoethyl)3-aminopropyl methyldimethoxy silane and denatured. According to this constitution, Si in a semiconductor chip and Si in a sealing resin are oxygen-crosslinked, thus displaying tough adhesive force, then remarkably increasing reliability on heat resistance and damp-proofing. When a resin having a flexural modulus of 50-300kg/mm at 170 deg.C is selected as the sealing resin, a stress relaxation effect at the time of a high temperature is added, thus further enhancing reliability. |
