发明名称 FORMATION OF CONCAVE SPHERICAL SURFACE OF PIN MOUNTED IN SEALING METAL MOLD OF LIGHT-EMITTING SEMICONDUCTOR ELEMENT
摘要 PURPOSE:To enable manufacturing a pin which has a high precision concave spherical surface in quantity without the dispersion in precision by forming the concave spherical surface on the tip of the pin fixed face to face with a punch formed with a convex spherical surface on the tip of the punch on the same central axis line by striking the tip of the punch on the tip of the pin with the reciprocating motion of the punch. CONSTITUTION:A jig 12 holds a punch 10 which can move in reciprocation in the direction of the axis line of the jig 12. A jig 13 also has a holder 13a which holds the jig 12 and a hole 13b which holds a pin 11. In a state wherein the jig 12 is inserted in the jig 13, the holes 12a, 13a have the same central axis line X. The jig 13 is fixed on the bolster 15a of a press 15 but fixing or removing is possible, the punch 10 is fixed on the bottom end of a top ram 15b and the convex spherical surface of the punch 10 is struck on the tip of the pin 11 held in the jig 13 by the descent of the top ram 15b. Then, the flat surface of the tip of the pin 11 is deformed to a concave spherical surface. Accordingly, the pin 20 formed in this way is mounted in a metal mold and is formed with a resin.
申请公布号 JPS62254477(A) 申请公布日期 1987.11.06
申请号 JP19860097740 申请日期 1986.04.26
申请人 MITSUBISHI METAL CORP 发明人 KANDA KATSUTOSHI
分类号 H01L23/48;B29C45/37;H01L33/54 主分类号 H01L23/48
代理机构 代理人
主权项
地址