| 摘要 |
PURPOSE:To contrive stabilization of characteristics by a method wherein electron parts are sealed in package through the intermediary of the buffer layer to be used for relaxation of stress. CONSTITUTION:A photoelectric conversion element and its circumferential circuit are formed on a silicon wafer, and after a passivation film has been formed thereon, the through hole of a bonding pad part is formed. Subsequently, a resin solution to be turned into a buffer layer 14 is spreadingly coated on the silicon wafer whereon each element is formed, and the resin of the bonding pad part and a lightreceiving part 13 are removed. The coated resin is dried up at a high temperature (300 deg.C or below), a solvent is evaporated, and the resin is hardened. The wafer formed as above-mentioned is divided together with a chip, and a chip 12 having the buffer 14 is formed. Subsequently, the chip 12 is fixed to a frame 11, and a packaging operation is performed using a clear mold 15. |
