| 摘要 |
PURPOSE:To form the pitch between terminals in a microscopic manner by a method wherein a pick-up terminal with which an electric connection is performed with a circuit substrate, is provided on the mounting surface of the main body of the title package, and they are connected using an insulative bonding agent. CONSTITUTION:A package and a printed wiring substrate are electrically connected by interposing a bonding agent between them and by performing positioning and pressure-welding operations. They can be pressurewelded by coating anisotropic conductive bonding agent on the whole surface of the connecting part of a circuit. As for conductive particles it is desirable to use abrasive grain like particles, because they produce an anchor effect on the surface of the opposing circuits. Pertaining to the method of adhesion, metal-plating in which conductive superhard material grains are misced is performed on the circuit of the circuit substrate or the pick-up terminal of the pinless package opposing to said circuit, and they are pressure-welded through the intermediary of an insulative bonding agent. As said particles are in an abrasive granular state and they have a high degree of hardness, they break the insulative bonding agent when the pressure-welding work is performed, they cut into the pick-up terminal of the package and the circuit of the circuit substrate and an electrical continuity is performed. |
