COOLING MEANS FOR INTEGRATED CIRCUIT CHIP DEVICE

摘要

Semiconductor assembly comprises (a) a substrate(12); (b) a semiconductor chip(10) having one surface bonded to the substrate, (c) a heat transfer element closely adjacent the second surface of the chip; (d) a thin layer(22) of heat conductive noneutectic alloy at the interface between heat transfer element and chip, pref. an alloy contg. Bi; and pref. (e) a spring type piston providing a load force to the heat transfer element, increasing contact between element and chip. The assembly pref. also includes a hat(20) providing a cover for the assembly and diffusing heat. A thin layer(22) of conductive noneutectic alloy is pref. provided at the interface between heat transfer element and hat surface. A diagonal spring type piston(16) pref. provides a load force increasing contact between heat transfer element and hat and chip surfaces. The thermal resistance of the chip interface is pref. 0.1-0.2 deg.C./W and of the heat interface is pref. 0.01-0.02 deg.C./W, both for contact load of 100g. The alloy allows resistance loads 5-7 times less than those obtd. using thermal grease.