发明名称 |
Method for producing a welded joint between the contact element of a semiconductor and an electrical connector |
摘要 |
A method for producing a welded joint between the contact element of a semiconductor, especially a solar cell, and an electrical connector, by means of a resistance welding process. In order to avoid impurities exacerbating or even preventing a good welded joint, the connector is initially welded on to the contact element by means of at least one ultrasound welding pulse. Subsequently, the resistance welding process is carried out in order actually to weld the contact element and the connector. A soft ultrasound welding pulse can be used, which produces a minimum mechanical adhesion strength between the contact element and the connector. |
申请公布号 |
DE3614849(A1) |
申请公布日期 |
1987.11.05 |
申请号 |
DE19863614849 |
申请日期 |
1986.05.02 |
申请人 |
LICENTIA PATENT-VERWALTUNGS-GMBH |
发明人 |
BEBERMEIER,HELMUT,DIPL.-PHYS.;BRAASCH,HAYO,DIPL.-ING.;PCHALEK,NORBERT,DIPL.-PHYS.;REUL,STEFAN,DIPL.-ING. |
分类号 |
H01L21/607;H01L31/05;H01R43/02;(IPC1-7):H01L21/60;H01L31/02;B23K11/32 |
主分类号 |
H01L21/607 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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