METHOD FOR ENCAPSULATING INTEGRATED CIRCUITS

摘要

For encapsulating integrated circuits mounted on a continuous dielectric strip (10) (surface-mounted circuits), it is proposed to cast by transfer a thermo-setting resin around the circuits carried by the strip, the injection of resin occurring outside the mating plane of the mould, contrary to what is usually done in this field. The protection of circuits is improved while preserving the testability on the strip.