| 摘要 |
<p>A surface mountable bipolar zener diode includes first and second semiconductor elements (1, 2), each of which defines a respective p-n junction (10, 11) near a respective inner face (36, 38), and each of which defines a respective metallized layer (26, 27) on a respective outer face (4, 5). The inner faces (36, 38) are soldered together such that the p-n junctions (10, 11) are disposed near the center of the assembled diode. The outer faces (26, 27) are operated parallel to one another and to the p-n junctions (10, 11) and are disposed perpendicularly to a pair of printed circuit board contacts (8, 9). Fillets (28, 29) of solder or conductive epoxy extend between the metallized layers (26, 27) and the printed circuit board contacts (8, 9) to interconnect the bipolar zener diode with the printed circuit board contacts (8, 9).</p> |
