| 摘要 |
<p>A pin arrangement for use in metal packaged microcircuits. The pin (20) includes an annular boss (21), sometimes referred to as an upset. The upset (21) is formed on the pin (20) at the point where the pin (20) is to be embedded in the glass hermetic seal (12). The upset (21) provides a horizontal plane against the surface of the glass (12), giving substantially greater mechanical strength to the pin (20) in the glass (12). Due to this greater surface area, minute cracking and chipping of the glass (12) at the point of contact is minimized. Further, due to the upset (21), the flow of glass (12) up the shaft of the pin (20) during the hermetic sealing process is retarded, thereby avoiding the critical area and all the problems inherent therewith. Additionally, not only does the upset (21) provide greater mechanical strength to the glass (12), the upset (21) also provides a focal point for pin flexion. When flexion occurs, the pin (20) will tend to bend on the outside of the hermetic seal (12) at the juncture of the pin shaft and the upset (21), rather than at the interior juncture of the pin shaft and the upset. Accordingly, the upset (21) acts as a strain relief point.</p> |
