发明名称 THERMOPLASTIC RESIN COMPOSITION
摘要 PURPOSE:A resin composition, obtained by melt blending a polyphenylene ether based resin with polyamide and rubber-like polymer in the presence of an unsaturated compound and peroxide and having improved processability, impact and heat resistance. CONSTITUTION:A composition obtained by melt blending (A) 4-95wt% polyphenylene ether based resin with (B) 4-95wt% polyamide, (C) 1-50wt% rubber-like polymer, preferably styrene-butadiene copolymer, ethylene-alpha-olefin copolymer, etc., and, as necessary, (D) <=91wt% styrene based resin in the presence of (E) an ethylenically unsaturated compound having functional group, e.g. carboxyl group, acid anhydride group, etc., preferably maleic anhydride in an amount of 0.001-10wt% based on the total amount of the components (A)-(D) and (F) an organic peroxide in an amount of 0.001-5wt% based on the total amount of the components (A)-(D), containing at least one of the components (A)-(C) dispersed therein, the weight-average particle size of the dispersed particles being <=5mum.
申请公布号 JPS62253652(A) 申请公布日期 1987.11.05
申请号 JP19860070579 申请日期 1986.03.28
申请人 JAPAN SYNTHETIC RUBBER CO LTD 发明人 MOTAI MASAAKI;ITO TETSUO;TSUCHIKAWA HIDEJI;KIMURA SHINICHI
分类号 C08L21/00;C08L25/04;C08L71/00;C08L71/12;C08L77/00;C08L79/08;C08L81/02;C08L81/06 主分类号 C08L21/00
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