| 摘要 |
PURPOSE:To perform direct connection between semiconductor elements, by applying a heat resisting resin film around a pad electrode of at least one of the neighboring semiconductor elements, and performing wire bonding. CONSTITUTION:Semiconductor elements 3 and 4 are mounted on the neighboring positions on a circuit board 1. A heat resisting resin 7 such as polyimide resin is applied around one or both pad electrodes 5 and 6 of the semiconductor elements. The two elements 3 and 4 are directly connected by wire bonding, with the resin 7 as a protecting film in the vicinity of the pad electrodes. The resin film 7 is made to function as a thermal and mechanical buffer layer against a bonding tool. Thus damage of inner wiring around the pad electrode 6 is avoided. In this way, direct connection between the elements 3 and 4 is carried out.
|
