发明名称 HEAT SINK ARRANGEMENT
摘要 A cooling arrangement for a thyristor (1) is in the form of a finned metallic heat sink and includes a chamber (11-14) which constitutes an isothermal region. By minimising the temperature drop across this region heat transfer to the more remote surface areas of the heat sink is greatly improved. The isothermal region takes the form of a heat pipe or thermosyphon, or a part thereof. Conveniently, the chamber is formed as an integral part of an extruded aluminium alloy, and contains a quantity of a volatile liquid, e.g. pentane. <IMAGE>
申请公布号 GB2151769(B) 申请公布日期 1987.11.04
申请号 GB19830034029 申请日期 1983.12.21
申请人 * MARCONI ELECTRONIC DEVICES LIMITED 发明人 COLIN BRIGHT * LEWIS;JOHN STEWART * OGILVIE
分类号 H01L23/427;(IPC1-7):F28D15/02 主分类号 H01L23/427
代理机构 代理人
主权项
地址