| 摘要 |
PURPOSE:To obtain the titled composition which can give a cured product excellent in reliability and a life and useful for, e.g., sealing semiconductor devices, by mixing an epoxy resin with solid and hollow inorganic fillers having mean particle diameters related with each other by a specified relationship and used in specified amounts and an organic dibasic acid anhydride. CONSTITUTION:An inorganic filler mixture (B) is obtained by mixing a solid inorganic filler (a) of a specific gravity >=2, such as hydrated alumina, fused silica or talc, with 40-95vol% hollow inorganic filler (b) having a mean particle diameter 0.5-6.0 times that of component (a), a nearly spherical shape and a mean specific gravity <=1. An epoxy resin (A) having at least one epoxy group in the molecule, such as an alicyclic epoxy resin, is mixed with 35-60vol% (based on the entire volume of the composition) component B and 0.7-1.3mol, per epoxy group of component A, organic dibasic acid anhydride (C), e.g., (methyl)hexahydrophthalic anhydride.
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