发明名称 VAPOR REFLOW TYPE SOLDERING DEVICE
摘要 <p>PURPOSE:To stabilize the generation of a saturated vapor, to reduce the recovery power and heat loss and to improve the reliability and economical efficiency of the device by cooling the recovery vapor of a gaseous phase soldering device, separating a hydroxyl and performing a heat exchange with the saturated vapor and recovery heat medium. CONSTITUTION:The body 15 to be worked is transferred by a conveyor 17, subjected to a gaseous phase soldering with the saturated vapor 15 of the heat medium 14 caused by a preheating 16 and heater 7, cooled in a cooling chamber 3 and subjected to a soldering. In such case, the saturated vapor 15 sucked out of exhaust ports 12, 13 by a suction pump 27 is liquefied 28 by being cooled with the cooling pipe 26 of a recovery device 25 and reproduced in good quality with a hydroxyl remover 29. It is then fed to a vapor cooling coil 11, the heating pipe 32, etc., of a transfer path 6 and gaseous phase chamber 1 and recovered to a vapor generation tank 4 with its viscosity being reduced by the temp. rise with the heat exchange. The generation of the saturated vapor 15 of the vapor generation tank 4 is well stabilized by this heating recovery. The reliability and economical efficiency of the device are improved by reducing the feeding power by lowering the viscosity with the temp. rise of the recovery medium.</p>
申请公布号 JPS62252671(A) 申请公布日期 1987.11.04
申请号 JP19860094498 申请日期 1986.04.25
申请人 HITACHI TECHNO ENG CO LTD 发明人 SANKAI HARUO;TSUCHIYA KEIZO
分类号 B23K1/015;H05K3/34 主分类号 B23K1/015
代理机构 代理人
主权项
地址