| 摘要 |
<p>PURPOSE:To apply a uniform thin metal film to a glass surface with high adhesive force, by pretreating a glass surface using a specific method prior to the metallization of a glass surface by electroless plating. CONSTITUTION:A surface of a glass plate is roughened with fine abrasive grains and washed after defatting. The surface is etched with 0.5% aqueous solution of hydrofluoric acid, sensitized, activated, plated with Cu at a thickness of 0.3mum by electroless plating and heat-treated at 500-800 deg.C in an oxidizing atmosphere for about 30min. The treated glass is etched by immersing in a mixed aqueous solution of 0.5% hydrofluoric acid and 1.5% hydrochloric acid, again sensitized and activated, plated with Cu at a thickness of 3.5mum by electroless plating and heat-treated at 600 deg.C for 30min in nitrogen gas atmosphere. A Cu layer having uniform thickness is formed by electroless plating on the glass plate in high adhesivity by this process.</p> |
