| 摘要 |
PURPOSE:To prevent the contamination of a semiconductor element and the yield of breakdown of bonding wire, by blocking the scattered lumps of a mounting and bonding material in a die bonding process, and completely preventing the movement of the lumps. CONSTITUTION:A narrow gap is formed by the inner walls of a semiconductor package 1 and a semiconductor element 3. A mounting and bonding material 2 is made to remin in the gap in a lump shape. The gap is buried with a heat resisting resin material 6 (silicon or polyimide synthetic resin). Then, the mounting and bonding material 2, which is yielded in a die bonding process and remains in the gap in the lump shape, is completely sealed in the resin material 6. Therefore, the lumps are not moved and rolled in the package hereinafter. Thus, thin metal wire for bonding is not damaged, and the semiconductor element is not contaminated. |
