| 摘要 |
PURPOSE:To make it possible to detatch electronic parts such as IC chips, which are packaged on a substrate, readily, by filling a space, which is surrounded by the substrate and a frame shaped member, with first liquid silicon until leads are immersed, and forming second hardened silicon thereon. CONSTITUTION:A plurality of input/output pins 2 are provided on the lower surface of a substrate 3 including a plurality of conductor wirings 1. A plurality of pads 8 are provided on the upper surface of the substrate 3. A frame member 10 is bonded to the periphery of the upper surface of the substrate 3. A cap 13 is attached to the frame member 10 so as to face the upper surface of the substrate 3. A plurality of spacers 9 are provided on the upper surface of the substrate 3. A plurality of integrated circuit chips 4 are fixed on the spacers 9. A space, which is surrounded by the upper surface of the substrate 3, the lower surface of the cap 13 and the side surfaces of the frame member 10, is filled with first liquid silicon 11. The upper part of the substrate and the upper part of the first silicon are covered with second hardened silicon 12. |
