| 摘要 |
There is disclosed a wiring substrate comprising a wiring circuit pattern formed on a metal substrate with an insulating resinous layer interposed therebetween. In this wiring substrate, the insulating resinous layer is formed of a high molecular composition comprising thermosetting 1,2-polybutadiene containing 5 to 30% by weight of a high molecular softening agent such as hydrogenated polybutadiene. A method of manufacturing such a wiring substrate is also disclosed, wherein a light-reflecting pigment is included in the insulating resinous layer for the convenience of the subsequent laser trimming.
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