Integrated circuit placement device vacuum head

摘要

A vacuum head (10) for pick-up and placement of integrated circuit devices (16, 16'). The apparatus includes an outer housing (18) enclosing therewithin an inner tip assembly (34). The inner tip assembly (34) is disposed for reciprocation through and past an orifice (24) formed in a fitting (26) closing one end of the casing (20) of the outer housing (18). The inner tip assembly (34) has formed therein a shoulder (76) which, when the assembly (34) is moved to an extended position, can engage a seat (78) formed in an inner surface of the fitting (26). An O-ring (80) can be interposed between the shoulder (76) and the seat (78) to preclude vacuum generated in vacuum chamber (30) from being directed other than through an orifice (68) formed in the inner tip assembly (34). An air cylinder (48) is provided to actuate the inner tip assembly (34) for movement between retracted and extended positions.