| 摘要 |
<p>A b s t r a c t he present invention relates to a process for pro_ viding foundations and/or reinforcing the ground under buildings (1), for example, and other suitable constructions such as road embankments, by taking out soil and replacing it with a lighter material, which is known as laying compensating foundations. The invention enables simple and effective relieving to be effected at constructions which have already been erected and commissioned. From a numbers of points (2-4) over the area (5) where it is intended to reinforce the ground a plurality of holes (6) is drilled in the soil material (7), or is made by some other expedient soil-removing method, extending in the desired directions, in such a way that soil material is left between the holes (6). The soil material removed from the said holes (6) which have been made is replaced with plastic material or some other suitable replacement material (9) with a lower density than the said removed soil material, whereby the stress diagram which the soil material bears over the actual area (5) is obtained.</p> |
