| 摘要 |
PURPOSE:To simply fix a semiconductor to a stationary member, such as a heat sink plate in close contact by providing a shape memory metal in close contact with the member by deforming it in a predetermined memory shape by heating at soldering time at the side of the member or a circuit substrate, such as the heat sink plate disposed near the semiconductor on the substrate to press a semiconductor device to bring it into contact with the member. CONSTITUTION:A heat sink plate 12 having a power transistor 10 and a shape memory metal 14 is associated within an automatic inserting unit to a printed substrate 1, and the substrate 1 is then dipped in a solder tank to be soldered. The transistor 10 is pressed fixedly with the plate 12 by the deformation of the metal 14 through the plate 12 due to the memory shape by the heat. Thus, a work for clamping a semiconductor device, such as the transistor at the plate is eliminated to completely automate the semiconductor device mounting work to the plate by an automatic inserting unit and an automatic soldering unit. |
