| 摘要 |
<p>PURPOSE:To prevent resin from being separated from a semiconductor element due to thermal load by forming a resin restricting region having a recess or a projection on the surface of the element and particularly part of a portion in contact with the resin. CONSTITUTION:A groove 11 is formed on the outer periphery of a bonding pad 10 on the surface of a semiconductor element 1 in contact with resin 5. When the groove 11 is, for example, formed by etching or pressing, the resin is filled in the groove 11 after resin-molding to increase the bonding strength in a boundary between the resin and the element 1, and the groove of the element 1 and the projection acts as a stopper for the separation due to thermal stress. Thus, it can prevent the separation, and even if the thermal stress is generated, the entire surface bonding state is held in the boundary.</p> |
