发明名称 INSPECTING METHOD FOR PACKAGING STATE OF PRINTED CIRCUIT BOARD PARTS
摘要 PURPOSE:To securely inspect the packaging state of parts by printing a mark in a shape which is smaller than the contour of the parts on a printed circuit board, mounting the parts here, and picking its image up by a TV camera. CONSTITUTION:The mark 2 which is a little bit smaller than the parts 3 is printed on the printed circuit board 1 in a color having excellent contrast with the board 1. The parts 3 is mounted on the mark 2 and the board 1 is mounted on a stage 4 which is driven and controlled by a controller 10. Illumination light 5 is projected on the board 1 and the image of the board 1 is picked up by the TV camera 6 and converted into binarization image information (indicating whether the mark 2 is present or not by '0' and '1'), which is stored in an image storage device 8; and this information is processed by a processor 9 to detect the packaging state of the parts 3. Then, the stage 4 is controlled by the controller 10 and moved in an X- and a Y-axial direction to perform inspection.
申请公布号 JPS62251608(A) 申请公布日期 1987.11.02
申请号 JP19860096450 申请日期 1986.04.24
申请人 FUJITSU LTD 发明人 TERUYA YOSHIHIRO
分类号 G01B11/24;H05K13/08 主分类号 G01B11/24
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